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PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate High Temperature Resistant, Corrosion Resistant Steel Plate for Circuit Board & Copper Clad Laminate Production
Dettagli:
| Luogo di origine: | Cina |
| Marca: | MK |
| Numero di modello: | MKSP-S630T |
Termini di pagamento e spedizione:
| Quantità di ordine minimo: | 50 pezzi |
|---|---|
| Prezzo: | negotiable |
| Imballaggi particolari: | Imballaggio in compensato resistente con materiale protettivo morbido adeguato all'interno, adatto p |
| Tempi di consegna: | 10-20 giorni lavorativi |
| Termini di pagamento: | L/C, D/A, D/P, T/T, Western Union |
| Capacità di alimentazione: | 10000 metri quadrati al mese |
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Informazioni dettagliate |
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| Materia prima: | Acciaio inossidabile domestico SUS630T di alta qualità | Spessore standard: | 1.0-2.0 mm |
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| Larghezza massima: | ≤ 1300 mm | Lunghezza massima: | ≤2410 mm |
| Nome del prodotto: | Piastra per pressa per laminazione PCB e CCL SUS630T | Rugosità superficiale: | Ra ≤ 0,15 μm, Rz ≤ 1,5 μm |
| Evidenziare: | SUS630T high-hardness lamination press plate,high-temperature resistant steel plate for PCB,corrosion resistant CCL production steel plate |
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Descrizione di prodotto
PCB & CCL SUS630T High-Hardness High-Precision Lamination Press Plate
MKSP-S630T high-precision lamination press plate utilizes premium domestic SUS630T stainless steel materials, delivering stable and reliable lamination performance with superior cost competitiveness. This specialized lamination steel plate for PCB and CCL production features exceptional thermal performance, high hardness, and outstanding corrosion resistance.
Product Advantages
SUS630T High-Hardness Lamination Press Plate | High Precision, High Temperature Resistance, Energy-Saving & Cost-Effective Solution for PCB & CCL Lamination
| Feature | Specification & Benefits |
|---|---|
| Raw Material | High-quality domestic SUS630T stainless steel with mature, stable material formula |
| Cost Performance | Reliable industrial-grade lamination quality with highly competitive pricing |
| Thermal Performance | Excellent thermal conductivity and stable thermal expansion coefficient for significant energy and cost savings |
| Material Performance | High hardness up to 50HRC±2, excellent corrosion resistance and mechanical stability |
| Equipment Compatibility | Universally compatible with all types of industrial lamination steel plate washing machines |
| Application Scenarios | Professional high-precision press plate for PCB printed circuit board and CCL copper clad laminate lamination processes |
Standard Sizes
PCB Lamination Press Plate (L × W, mm):
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm):
1910×1270, 2210×1270, 2220×1270
1910×1270, 2210×1270, 2220×1270
Detailed Performance Parameters
| Performance Parameter | Mass-Lam Plate (SUS630T) | Pin-Lam Plate (SUS630T) |
|---|---|---|
| Thickness | 1.0-2.0mm | 1.0-2.0mm |
| Max Width | ≤1300mm | ≤1300mm |
| Max Length | ≤2410mm | ≤2410mm |
| Thickness Tolerance | ±0.10mm | ±0.10mm |
| Surface Roughness | Ra≤0.15μm, Rz≤1.5μm | Ra≤0.15μm, Rz≤1.5μm |
| Positioning Hole Tolerance | -- | ±0.10mm |
| Standard Bushing Slot Tolerance | -- | 0 ~ +0.10mm |
| Warpage Degree | ≤3mm/M | ≤3mm/M |
| Length & Width Tolerance | ±1mm | ±1mm |
| Yield Strength | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile Strength | ≥1400 N/mm² | ≥1400 N/mm² |
| Extensibility | ≥5% | ≥5% |
| Hardness | 50HRC±2 | 50HRC±2 |
| Max Working Temperature | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03mm | ≤0.03mm |
| Diagonal Deviation | 1-2mm | 1-2mm |
| Thermal Conductivity (@300℃) | ≥18W/MK | ≥18W/MK |
| Average Thermal Expansion Coefficient | 10~12 (10⁻⁶/℃) | 10~12 (10⁻⁶/℃) |
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