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2.0mm PCB & CCL SUS301H Ultra-Thin Lamination Press Plate for PCB or CCL laminator
Dettagli:
| Luogo di origine: | Cina |
| Marca: | MK |
| Numero di modello: | MKSP-S630T |
Termini di pagamento e spedizione:
| Quantità di ordine minimo: | 50 pezzi |
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| Prezzo: | negotiable |
| Imballaggi particolari: | Imballaggio in compensato resistente con materiale protettivo morbido adeguato all'interno, adatto p |
| Tempi di consegna: | 10-20 giorni lavorativi |
| Termini di pagamento: | L/C, D/A, D/P, T/T, Western Union |
| Capacità di alimentazione: | 10000 metri quadrati al mese |
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Informazioni dettagliate |
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| Materia prima: | Acciaio inossidabile SUS301H importato di alta qualità | Spessore standard: | Calibro personalizzato ultrasottile da 0,5 mm / 1,0 mm / 1,2 mm |
|---|---|---|---|
| Applicazione: | Piastra di supporto per laminazione professionale per circuiti stampati PCB e laminati rivestiti in | Dimensioni standard (L*W mm): | 1500*1295, 1300*800, 1295*787, 1295*1613, 1295*1143, 1285*750, 1280*1120mm ecc |
| Nome del prodotto: | Piastra di stampa per laminazione ultrasottile PCB e CCL SUS301H | Tolleranza di dimensione in L/W: | ± 1 mm |
| Evidenziare: | 2.0mm PCB lamination press plate,ultra-thin CCL SUS301H plate,PCB laminator press plate |
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Descrizione di prodotto
Product Overview
MKSP-S301 ultra-thin lamination press plate is manufactured with high-quality imported German and Japanese SUS301H stainless steel materials. Featuring ultra-thin design and stable, reliable lamination performance, this cost-effective solution is optimized for PCB and CCL mass production lamination processes.
The ultra-thin structural design enables more stacking layers during each lamination cycle, significantly boosting production throughput. It reduces interlayer temperature differences inside the laminator, stabilizes board thermal expansion and contraction, and eliminates copper plate wrinkling defects caused by uneven heat conduction.
Universally compatible with all mainstream lamination steel plate washing machines, this product delivers high adaptability for diverse production scenarios.
Standard Sizes
PCB Lamination Press Plate (L × W, mm)
1500×1295, 1300×800, 1295×787, 1295×1613, 1295×1143, 1295×787, 1285×750, 1280×1120, 1280×1070, 1280×970, 1270×1118, 1270×1070, 1143×660, 673×571, 660×508, 24"×28"
CCL Lamination Press Plate (L × W, mm)
1910×1270, 2210×1270, 2220×1270
Premium SUS301H Ultra-Thin Press Plate | High Productivity, Stable Lamination, Anti-Wrinkle Solution for PCB & CCL Manufacturing
Core Product Advantages
- Raw Material: Premium imported SUS301H stainless steel (German/Japanese raw material) with high rigidity and durability
- Standard Thickness: 0.5mm / 1.0mm / 1.2mm ultra-thin customized gauge
- Production Optimization: Supports more lamination stacking layers to effectively improve production capacity; reduces interlayer temperature difference to stabilize board size tolerance
- Thermal Performance: Excellent thermal conductivity and stable thermal expansion coefficient, completely solving copper plate wrinkling problems
- Equipment Compatibility: Fully adaptable to all types of industrial lamination steel plate washing machines
- Application Scenarios: Professional lamination supporting plate for PCB printed circuit boards and CCL copper clad laminates
- Cost Performance: Reliable industrial-grade quality with competitive pricing and lower comprehensive production cost
Performance Parameters
| Parameter | SUS630T Mass-Lam Plate | SUS630T Pin-lam Plate |
|---|---|---|
| Thickness | 1.0-2.0mm | 1.0-2.0mm |
| Width | ≤1300 | ≤1300 |
| Length | ≤2410 | ≤2410 |
| Thickness tolerance | ±0.10 | ±0.10 |
| Surface roughness (um) | Ra≤0.15 Rz≤1.5 | Ra≤0.15 Rz≤1.5 |
| Positioning hole to hole tolerance | -- | +/-0.10 |
| Standard bushing slot tolerance | -- | +0.10/-0mm |
| Warpage degree | ≤3mm/M | ≤3mm/M |
| L/W size tolerance | ±1mm | ±1mm |
| Yield strength | ≥1175 N/mm² | ≥1175 N/mm² |
| Tensile strength | ≥1400 N/mm² | ≥1400 N/mm² |
| Extensibility | ≥5% | ≥5% |
| Hardness HRC | 50HRC±2 | 50HRC±2 |
| Work temperature | ≤400℃ | ≤400℃ |
| Parallelism | ≤0.03 | ≤0.03 |
| Diagonal deviation | 1-2mm | 1-2mm |
| Thermal conductivity | ≥18W/MK at 300℃ | ≥18W/MK at 300℃ |
| Average thermal expansion coefficient (10⁻⁶/℃) | 10~12 | 10~12 |
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